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The New Type Can Be Customized Sucker Type High Speed Thinning Machine, Wafer Thinner, New Type Can Be Customized

Supplier Shenzhen Ponda Grinding Technology Co.,Ltd.
Price $20000.00 / Piece
Availability In Stock
Mini Order:
+-
Subtotal: $20000

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Eligible for refunds within 30 days of receiving products. returns and refunds 

 
Model NO.
FD-150WH
Abrasive
Recyclable Water & Grinding Wheel
Wheel Rotate Speed
0-3000 Rpm
Workpiece Accuracy Control(Parallelism)
1um
Power of Grinding Wheel Motor
5.5kw
Transport Package
Wood Crate
Trademark
PONDA
Origin
China
Production Capacity
500 Unit/Year
Power Source:
Electricity
Disc(Wheel) Type:
Grinding Disc
Variable Speed:
With Variable Speed
Service:
Oversea Setup & After-Sale Avalaible
Class:
Thinner
Process Station:
1
Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
Products Show
The New Type Can Be Customized Sucker Type High Speed Thinning Machine


APPLICATION
ProcessIndustry by SubstanceIndustry by Applicability
High
Speed
Grinding
& Thinning
Metal And Alloy
Ceramic
Oxide
Carbide
Glass
Plastic
Nature Stone
Sealingsealing ring(liquid, oil, gas)
Semiconductorsubstrate(Al2O3, Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN) used in Wafer, LED., etc
PlasticHard Plastic
Optics(flat)optical lens, optical reflector, holographic glass, HUD glass, screen glass
Gemstonejade, sapphire, agate, etc.
Othersgauge block, micrometer gauge, friction plate, metal components, and any other precise hardware.
*NOTE: spiral stripe appears after high speed grinding and thinning. To dispel it, lap or polish are needed.


SPECIFICATION
Standard Specification
Machine ModelFD170TFD220TFD320TFD450T
Station DiameterΦ150 mm / 6 inchesΦ220 mm / 8 inchesΦ320 mm / 12 inchesΦ460 mm / 18 inches
Max. Workpiece DimensionΦ150×30 mmΦ220×50 mmΦ320×50 mmΦ460×50 mm
Process Thickness50μm≤N75μm≤N95μm≤N120μm≤N
Grating Resolution0.5 μm0.5 μm0.5 μm0.5 μm
Number of Station1111
Wheel Rotate Speed0-3000 rpm0-3000 rpm0-3000 rpm0-3000 rpm
Station Rotate Speed0-300 rpm0-300 rpm0-300 rpm0-300 rpm
Total Weight650 kg850 kg900 kg920 kg
Total Floor Space1200×550 mm1150×1200 mm1150×1200 mm1150×1200 mm
Built-In Optional Kits
GradeStandardAdvanced
Slurry Recycle System-Integrated with PLC
Dressing System-Integrated with PLC
Station FixingMechanical FixturePneumatic Vacuum Fixing
SpindleMechanicalPneumatic
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.


SAMPLE DEMONSTRATION (THINNING)
The New Type Can Be Customized Sucker Type High Speed Thinning Machine

The New Type Can Be Customized Sucker Type High Speed Thinning Machine
Patent
The New Type Can Be Customized Sucker Type High Speed Thinning Machine

FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.

Q2: Does Ponda charge for making samples?
A: ,.
Q3: ?
A: ,. 
Q4: ?
A: 15 ., 15 .
Q5: ?
A: ,.
Q6: ?
A: 21,5,15,100. 
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