Model NO.
FD-460XL
Service
Oversea Setup & After-Sale Avalaible
Class
Single Plate
Process Station
3
Pressure Source
Pneumatic or Weight Block
Plate Material
Metal & Non-Metal
Abrasive
Slurry
Weight
850kg
Transport Package
Wood Crate
Trademark
PONDA
Origin
China
Production Capacity
500 Unit/Year
Type:
Lapping Machine
Power Source:
Electricity
Disc(Wheel) Type:
Grinding Disc
Material:
Metal and Non-Metal
Disc Diameter:
Φ610 mm / 24 Inches
Variable Speed:
With Variable Speed
?
,.,,,,,,,60, 000;,SiC ,,,,.
:
LED,,,,,,,.:LED
,,,,,,,.
:
1,,.,±0.002mm
2,,;
3,PLC,,.
SPECIFICATION
SAMPLE DEMONSTRATION
Company profile
Patent
FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: ?
A: ,.
Q3: ?
A: ,.
Q4: ?
A: 15 ., 15 .
Q5: ?
A: ,.
Q6: ?
A: 21,5,15,100.
,.,,,,,,,60, 000;,SiC ,,,,.
:
LED,,,,,,,.:LED
,,,,,,,.
:
1,,.,±0.002mm
2,,;
3,PLC,,.
Process | Industry by Substance | Industry by Applicability | |
Single Plate Lapping & Polishing | Metal And Alloy Ceramic Oxide Carbide Glass Plastic Nature Stone | Sealing | valve and sealing ring(liquid, oil, gas) |
Semiconductor | LED substrate(Al2O3, Si, SiC) wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN) | ||
Plastic | PE, E/VAC, SBS, SBR, NBR, SR, BR, PR | ||
Phone Frame(flat) | back plate | ||
PCB | adhesive, coating, circuit | ||
Optics(flat) | optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass | ||
Radar | oxide coating plate | ||
Gemstone | jade, sapphire, agate, etc. | ||
Others | graphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware. | ||
*NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning (≤100μm), thinner machine are needed. |
SPECIFICATION
Standard Specification | |||||||
Machine Model | FD3803 | FD4603 | FD6103 | FD9104 | |||
Plate Diameter | Φ380 mm / 15 inches | Φ460mm / 18 inches | Φ610mm / 24 inches | Φ910mm / 36 inches | |||
Max. Workpiece Diameter (without conditioning ring) | Φ180 mm | Φ220 mm | Φ270 mm | Φ420 mm | |||
Conditioning Ring Diameter | Φ180 mm | Φ220 mm | Φ270 mm | Φ420 mm | |||
Number of Station | 3 | 3 | 3 | 4 | |||
Plate Rotate Speed | 0-140 rpm | 0-140 rpm | 0-120 rpm | 0-90 rpm | |||
Facing & Grooving Speed (Not include in Polishing) | 0-120 mm/m | 0-120 mm/m | 0-120 mm/m | 0-120 mm/m | |||
Total Weight | 450 kg | 850 kg | 1000 kg | 1600 kg | |||
Total Floor Space | 670×940 mm | 1030×730 mm | 1920×840 mm | 2100×1300 mm | |||
Built-In Optional Kits | |||||||
Grade | Standard | Upgraded | Advanced | ||||
Controls | Digital | Digital | Touch-Screen PLC | ||||
Pressure Source | Hand Weight Block | Pneumatic Weight Block Manual | Pneumatic Press Integrated with PLC | ||||
Slurry Supply System | - | Manual | Digital, Manual | ||||
Cylinder Bar Drive System | - | Manual | Integrated with PLC | ||||
Conditioning Ring Drive System | - | Manual | Integrated with PLC | ||||
Machine Enclosure | - | Framed by Aluminum Alloy | Framed by Metal Plate | ||||
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary. |
SAMPLE DEMONSTRATION
Company profile
Factory front desk
Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and its
supporting products and consumable materials
supporting products and consumable materials
Patent
FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: ?
A: ,.
Q3: ?
A: ,.
Q4: ?
A: 15 ., 15 .
Q5: ?
A: ,.
Q6: ?
A: 21,5,15,100.
Send Message