Model NO.
FD-350
Disc Diameter
320mm
Variable Speed
With Variable Speed
Service
Oversea Setup & After-Sale Avalaible
Class
Thinner
Process Station
1
Abrasive
Recyclable Water & Grinding Wheel
Wheel Rotate Speed
0-3000 Rpm
Workpiece Accuracy Control(Parallelism)
1um
Power of Grinding Wheel Motor
5.5kw
Transport Package
Wood Crate
Trademark
PONDA
Origin
China
Production Capacity
500 Unit/Year
Type:
Surface Grinding Machine
Power Source:
Electricity
Object:
Sapphire Substrate, Silicon Wafer, Ceramic Wafer,
Application:
Grinding Industry
Disc(Wheel) Type:
Grinding Disc
Material:
Hard Brittle Materials of Nonmetals and Metals
Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
Main uses:
The equipment is mainly used for high speed thinning of thin precision parts of hard brittle materials such as sapphire substrate, silicon wafer, ceramic sheet, optical glass, quartz crystal and other semiconductor materials.
Products Show
APPLICATION
SPECIFICATION
SAMPLE DEMONSTRATION (THINNING)
About the Company
Factory front desk
Production and assembly shop
Patent
FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: ,.
Q3: ?
A: ,.
Q4: ?
A: 15 ., 15 .
Q5: ?
A: ,.
Q6: ?
A: 21,5,15,100.
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
Main uses:
The equipment is mainly used for high speed thinning of thin precision parts of hard brittle materials such as sapphire substrate, silicon wafer, ceramic sheet, optical glass, quartz crystal and other semiconductor materials.
Products Show
APPLICATION
| Process | Industry by Substance | Industry by Applicability | |
| High Speed Grinding & Thinning | Metal And Alloy Ceramic Oxide Carbide Glass Plastic Nature Stone | Sealing | sealing ring(liquid, oil, gas) |
| Semiconductor | substrate(Al2O3, Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN) used in Wafer, LED., etc | ||
| Plastic | Hard Plastic | ||
| Optics(flat) | optical lens, optical reflector, holographic glass, HUD glass, screen glass | ||
| Gemstone | jade, sapphire, agate, etc. | ||
| Others | gauge block, micrometer gauge, friction plate, metal components, and any other precise hardware. | ||
| *NOTE: spiral stripe appears after high speed grinding and thinning. To dispel it, lap or polish are needed. | |||
SPECIFICATION
| Standard Specification | ||||||
| Machine Model | FD170T | FD220T | FD320T | FD450T | ||
| Station Diameter | Φ150 mm / 6 inches | Φ220 mm / 8 inches | Φ320 mm / 12 inches | Φ460 mm / 18 inches | ||
| Max. Workpiece Dimension | Φ150×30 mm | Φ220×50 mm | Φ320×50 mm | Φ460×50 mm | ||
| Process Thickness | 50μm≤N | 75μm≤N | 95μm≤N | 120μm≤N | ||
| Grating Resolution | 0.5 μm | 0.5 μm | 0.5 μm | 0.5 μm | ||
| Number of Station | 1 | 1 | 1 | 1 | ||
| Wheel Rotate Speed | 0-3000 rpm | 0-3000 rpm | 0-3000 rpm | 0-3000 rpm | ||
| Station Rotate Speed | 0-300 rpm | 0-300 rpm | 0-300 rpm | 0-300 rpm | ||
| Total Weight | 650 kg | 850 kg | 900 kg | 920 kg | ||
| Total Floor Space | 1200×550 mm | 1150×1200 mm | 1150×1200 mm | 1150×1200 mm | ||
| Built-In Optional Kits | ||||||
| Grade | Standard | Advanced | ||||
| Slurry Recycle System | - | Integrated with PLC | ||||
| Dressing System | - | Integrated with PLC | ||||
| Station Fixing | Mechanical Fixture | Pneumatic Vacuum Fixing | ||||
| Spindle | Mechanical | Pneumatic | ||||
| *NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary. | ||||||
SAMPLE DEMONSTRATION (THINNING)
About the Company
Factory front desk
Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and its
supporting products and consumable materials
We have a production workshop and testing equipment, assembly workers and mechanical design engineers
45 people
45 people
Patent
FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: ,.
Q3: ?
A: ,.
Q4: ?
A: 15 ., 15 .
Q5: ?
A: ,.
Q6: ?
A: 21,5,15,100.
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