Model NO.
FD-320T
Service
Oversea Setup & After-Sale Avalaible
Class
Thinner
Process Station
1
Abrasive
Recyclable Water & Grinding Wheel
Wheel Rotate Speed
0-3000 Rpm
Workpiece Accuracy Control(Parallelism)
1um
Power of Grinding Wheel Motor
5.5kw
Transport Package
Wood Crate
Trademark
PONDA
Origin
China
Production Capacity
500 Unit/Year
Type:
Vertical Thinning Equipment
Power Source:
Electricity
Application:
Used for Sapphire Substrate, Silicon Wafer, Cerami
Disc(Wheel) Type:
Grinding Disc
Disc Diameter:
320mm
Variable Speed:
With Variable Speed
Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
Products Show
Vertical thinning machine main features:
1. The machine adopts high precision screw and guide rail components, the driving mode is servo drive, according to the workpiece of different materials and process requirements by PLC control of the driving mode and the corresponding change of screw speed, that is, the grinding wheel feed speed, the speed is adjustable from 0.001-5mm/min, the control feed precision is detected by high resolution grating ruler.
2. This machine adopts advanced Taiwan brand PLC and touch screen, high degree of automation, man-machine dialogue, simple operation at a glance.
3. The equipment can detect the grinding torque and automatically adjust the workpiece grinding speed, so as to prevent the workpiece from deformation and damage due to excessive pressure in the grinding process, and automatically compensate the grinding wheel wear thickness, so that the thickness of the 150 wafer can be reduced to 0.08mm thick without breaking. And the parallelism and flatness can be controlled within the range of ±0.002mm.
4. High thinning efficiency, LED sapphire substrate grinding speed per minute can be reduced up to 48 microns. Silicon wafers can be thinned up to 250 microns per minute.
APPLICATION
SPECIFICATION
SAMPLE DEMONSTRATION (THINNING)
Patent
Factory front desk
Production and assembly shopDelivery & Packing
Packing Details : Packing, 1 pcs/carton.
FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, SiC wafer, ceramics, glass, industrial sapphire, plastics, and any other composites.
Products Show
Vertical thinning machine main features:1. The machine adopts high precision screw and guide rail components, the driving mode is servo drive, according to the workpiece of different materials and process requirements by PLC control of the driving mode and the corresponding change of screw speed, that is, the grinding wheel feed speed, the speed is adjustable from 0.001-5mm/min, the control feed precision is detected by high resolution grating ruler.
2. This machine adopts advanced Taiwan brand PLC and touch screen, high degree of automation, man-machine dialogue, simple operation at a glance.
3. The equipment can detect the grinding torque and automatically adjust the workpiece grinding speed, so as to prevent the workpiece from deformation and damage due to excessive pressure in the grinding process, and automatically compensate the grinding wheel wear thickness, so that the thickness of the 150 wafer can be reduced to 0.08mm thick without breaking. And the parallelism and flatness can be controlled within the range of ±0.002mm.
4. High thinning efficiency, LED sapphire substrate grinding speed per minute can be reduced up to 48 microns. Silicon wafers can be thinned up to 250 microns per minute.
APPLICATION
| Process | Industry by Substance | Industry by Applicability | |
| High Speed Grinding & Thinning | Metal And Alloy Ceramic Oxide Carbide Glass Plastic Nature Stone | Sealing | sealing ring(liquid, oil, gas) |
| Semiconductor | substrate(Al2O3, Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN) used in Wafer, LED., etc | ||
| Plastic | Hard Plastic | ||
| Optics(flat) | optical lens, optical reflector, holographic glass, HUD glass, screen glass | ||
| Gemstone | jade, sapphire, agate, etc. | ||
| Others | gauge block, micrometer gauge, friction plate, metal components, and any other precise hardware. | ||
| *NOTE: spiral stripe appears after high speed grinding and thinning. To dispel it, lap or polish are needed. | |||
SPECIFICATION
| Standard Specification | ||||||
| Machine Model | FD170T | FD220T | FD320T | FD450T | ||
| Station Diameter | Φ150 mm / 6 inches | Φ220 mm / 8 inches | Φ320 mm / 12 inches | Φ460 mm / 18 inches | ||
| Max. Workpiece Dimension | Φ150×30 mm | Φ220×50 mm | Φ320×50 mm | Φ460×50 mm | ||
| Process Thickness | 50μm≤N | 75μm≤N | 95μm≤N | 120μm≤N | ||
| Grating Resolution | 0.5 μm | 0.5 μm | 0.5 μm | 0.5 μm | ||
| Number of Station | 1 | 1 | 1 | 1 | ||
| Wheel Rotate Speed | 0-3000 rpm | 0-3000 rpm | 0-3000 rpm | 0-3000 rpm | ||
| Station Rotate Speed | 0-300 rpm | 0-300 rpm | 0-300 rpm | 0-300 rpm | ||
| Total Weight | 650 kg | 850 kg | 900 kg | 920 kg | ||
| Total Floor Space | 1200×550 mm | 1150×1200 mm | 1150×1200 mm | 1150×1200 mm | ||
| Built-In Optional Kits | ||||||
| Grade | Standard | Advanced | ||||
| Slurry Recycle System | - | Integrated with PLC | ||||
| Dressing System | - | Integrated with PLC | ||||
| Station Fixing | Mechanical Fixture | Pneumatic Vacuum Fixing | ||||
| Spindle | Mechanical | Pneumatic | ||||
| *NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary. | ||||||
SAMPLE DEMONSTRATION (THINNING)
Patent
About the Company
Factory front desk
Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and its
supporting products and consumable materials
We have a production workshop and testing equipment, assembly workers and mechanical design engineers
45 people
45 people
Packing Details : Packing, 1 pcs/carton.
FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.
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