Cautop Vehicle & Parts

Wafer Back Grinder Mdfd-300vst, Grinder and Polisher, Grinder

Supplier Guangzhou Minder-Hightech co.,Ltd
Price $ 15000.00 / Piece
Availability In Stock
Mini Order: 1   Piece
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Product detail

Model NO.
MDFD-300VST
HS Code
8015809090
Production Capacity
200PCS/Yearpcs/Year
Product Description
Application:

mainly used at silicon wafer, ceramic,glass,quartz crystal,sapphire,semiconductors precision thinning(grinding) .
it is made from sucker, sucker main axis,grinding wheel, grinding wheel main axis,and driving part and guide screw etc.
Sucker: can be chosen to electromagnetism sucker or vacuum sucker,sucker diameter can be 320mm-600mm.
Sucker main axis driving method is frequency control of motor speed, anti-clockwise rotary,speed 3-140 adjustable.
Grinding wheel:the diameter of grinding wheel is depend on the diameter of sucker, have 150/170/210/300mm type. the granularity(roughness) of the grinding wheel is depend on the process.
Grinding wheel main axis:frequency control of motor speed, 3000-8000 adjustable.
Guide screw feeding part:high precision guide screw feeding part, serve driving, 0.001-5mm/min adjustable,it is checked by grating ruler.
this machine is very easy for operator.



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