Vertical Grinder Wafer Back Grinder Mdfd-320, Grinder and Polisher, Grinder
| Supplier | Guangzhou Minder-Hightech co.,Ltd |
|---|---|
| Price | $ 15000.00 / Piece |
| Availability | In Stock |
| Mini Order: | 1 Piece |
Purchase details
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Eligible for refunds within 30 days of receiving products.
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Product detail
Model NO.
MDFD-320
HS Code
8015809090
Production Capacity
200PCS/Yearpcs/Year
Product Description
Vertical grinder MDFD-320
It is made from sucker, sucker main axis,grinding wheel, grinding wheel main axis,and driving part and guide screw etc.
Sucker: can be chosen to electromagnetism sucker or vacuum sucker,sucker diameter can be 320mm-600mm.
Sucker main axis driving method is frequency control of motor speed, anti-clockwise rotary,speed 3-140 adjustable.
Grinding wheel:the diameter of grinding wheel is depend on the diameter of sucker, have 150/170/210/300mm type. the
granularity(roughness) of the grinding wheel is depend on the process.
Grinding wheel main axis:frequency control of motor speed, 3000-8000 adjustable.
Guide screw feeding part:high precision guide screw feeding part, serve driving, 0.001-5mm/min adjustable,it is checked by grating ruler.
This machine is very easy for operator.
Mainly used at silicon wafer, ceramic,glass,quartz crystal,sapphire,semiconductors precision thinning(grinding) .
Specification:
Vertical grinder MDFD-320
It is made from sucker, sucker main axis,grinding wheel, grinding wheel main axis,and driving part and guide screw etc.
Sucker: can be chosen to electromagnetism sucker or vacuum sucker,sucker diameter can be 320mm-600mm.
Sucker main axis driving method is frequency control of motor speed, anti-clockwise rotary,speed 3-140 adjustable.
Grinding wheel:the diameter of grinding wheel is depend on the diameter of sucker, have 150/170/210/300mm type. the
granularity(roughness) of the grinding wheel is depend on the process.
Grinding wheel main axis:frequency control of motor speed, 3000-8000 adjustable.
Guide screw feeding part:high precision guide screw feeding part, serve driving, 0.001-5mm/min adjustable,it is checked by grating ruler.
This machine is very easy for operator.
Mainly used at silicon wafer, ceramic,glass,quartz crystal,sapphire,semiconductors precision thinning(grinding) .
Specification:
| Sucker(chucktable) | D320-D600 | Main motor | 2.2kw 0-280RPM |
| Grinding wheel | D150-D200 | Feed motor | 750w |
| Workpiece Thickness b | 0.8<=b<=50mm | Spindle | 4kw/3000-8000RPM |
| Flatness | +-2um(50*50) | Sand pump motor | 250w |
| Best workpiece diameter | D50 | Grating system | 0.001mm |
| Location accuracy | 3um | Dimension | 1125*2000*1750mm |
| Working station | depending | Weight | 700kg |
| air source | 0.6mpa | power | 380v*3 |