Rapid Thinning of Metal Material for Ceramic Back Cover of Mobile Phone, Thinning Machine, Suitable for Ultra-Thin Products
| Supplier | Shenzhen Ponda Grinding Technology Co.,Ltd. |
|---|---|
| Price | $ 20000.00 / Piece |
| Availability | In Stock |
| Mini Order: | 1 Piece |
Purchase details
Payments:
Tax:
Tax Included
Returns & Refunds:
Eligible for refunds within 30 days of receiving products.
returns and refunds
Product detail
Model NO.
YM-150WH
Abrasive
Recyclable Water & Grinding Wheel
Wheel Rotate Speed
0-3000 Rpm
Workpiece Accuracy Control(Parallelism)
1um
Power of Grinding Wheel Motor
5.5kw
Transport Package
Wood Crate
Trademark
PONDA
Origin
China
Production Capacity
500 Unit/Year
Power Source:
Electricity
Disc(Wheel) Type:
Grinding Disc
Variable Speed:
With Variable Speed
Service:
Oversea Setup & After-Sale Avalaible
Class:
Thinner
Process Station:
1
?
,.,,,,,,,60, 000;,SiC ,,,,.
()
FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: ,.
Q3: ?
A: ,.
Q4: ?
A: 15 ., 15 .
Q5: ?
A: ,.
Q6: ?
A: 21,5,15,100.
,.,,,,,,,60, 000;,SiC ,,,,.
| (,,) | |||
| (Al 2 O 3 , Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN) Wafer, LED | |||
| () | ,,,HUD, | ||
| ,, | |||
| ,,,. | |||
| *:.,. | |||
| FD170T | FD220T | FD 320T | FD450T | |||
| Φ 150 /6 | Φ 220 /8 | Φ 320 / 12 | Φ 460 / 18 | |||
| . | Φ 150×30 | Φ 220 × 50 | Φ 320×50 | Φ 460×50 | ||
| 50μm≤N | 75μm≤N | 95μm≤N | 120μm≤N | |||
| 0.5 | 0.5 | 0.5 | 0.5 | |||
| 1 | 1 | 1 | 1 | |||
| 0-3000 | 0-3000 | 0-3000 | 0-3000 | |||
| 0-300 | 0-300 | 0-300 | 0-300 | |||
| 650 | 850 | 900 | 920 | |||
| 1200×550 | 1150×1200 | 1150×1200 | 1150×1200 | |||
| - | PLC | |||||
| - | PLC | |||||
| *:,. | ||||||
()
FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: ,.
Q3: ?
A: ,.
Q4: ?
A: 15 ., 15 .
Q5: ?
A: ,.
Q6: ?
A: 21,5,15,100.